Intel seems to have hit a bit of a brick wall when it comes to wafer design and scaling. While they do a bit better job that I can do, they still seem to be stuck on 14nm - for the fouth generation in a row. It seems as though the 8th generation CPUS will focus more on the "Y" and "U" line - meaning that mobile is first priority. It will be intesting to see what they can pull off with the same basic CPU die size.
With Intel stringing out 14nm (or at least, an improved variant of 14nm as we’ve seen on 7th Gen) for another generation, it makes us wonder where exactly Intel can promise future performance or efficiency gains on the design unless they start implementing microarchitecture changes.